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Laser drilling machine Product List

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Precision Hole Drilling Laser Processing Machine 'TLSM-401'

Precision Hole Drilling Laser Processing Machine 'TLSM-401'

Achieving both processing capability and machining precision with a unique optical system and high-speed laser scanning technology! A new proposal for micro-hole processing in functional films!

The precision hole-drilling laser processing machine "TLSM-401" is a laser processing machine that achieves a processing speed of 500 holes in 1.5 seconds and a processing accuracy of 5µm (for Φ0.2mm holes) through its unique optical system and high-speed laser scanning technology.

  • Other processing machines
  • Laser drilling machine

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Precision Hole Drilling Laser Processing Machine 'TLSM-401'

Precision Hole Drilling Laser Processing Machine 'TLSM-401'

For precise hole drilling in film! Achieves a processing speed of 500 holes in 1.5 seconds with a taper of 5μm.

The TLSM-401 is a precision laser drilling machine equipped with a unique optical system that reduces thermal impact on the workpiece, achieving a balance between quality and speed. Laser drilling offers the advantage of stable quality due to its non-contact processing. Furthermore, because it is non-contact, it allows for drilling materials that are difficult to process with cutting tools, as well as position correction through image alignment. It is widely used in advanced precision processing, and the demand for precision drilling in the manufacturing of new products is expected to continue. 【Features】 - Capable of precision drilling with a taper of 5μm and a diameter of 0.2mm - Achieves high-speed processing of 500 holes in just 1.5 seconds - Reduces thermal impact on the workpiece through its unique optical system - Capable of processing various materials, including films *For more details, please download the PDF or feel free to contact us.

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  • Laser drilling machine

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PuriKen Co., Ltd. Introduction of Printed Circuit Board Equipment

PuriKen Co., Ltd. Introduction of Printed Circuit Board Equipment

We conduct daily equipment inspections to provide better products!

Our company has various equipment for performing maskless processing. We possess "LDI (Direct Imaging System)" for pattern exposure and resist exposure (formation), as well as "IJP (Ink Jet Printer)" for symbol creation. Additionally, for the manufacturing of high-density build-up substrates, we use the "Mitsubishi laser processing machine for substrate drilling" and the "Via Mechanics single-axis drilling machine (equipped with a vision system)." 【Features of Maskless Processing】 - Short delivery times and reduced initial costs due to the absence of mask production and management - Ability to respond to short delivery times even for repeat orders - Lot tracing is possible by digitizing symbols - High-precision substrate manufacturing is achievable through our unique correction technology and LDI *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Laser drilling machine

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